3M™ Thermal Bonding Film 583
Use 3M™ Thermal Bonding Film 583 for low temperature bonding applications, such as bonding flex antenna and metal face plates to a chassis, or splicing glass fabric in PCB board manufacturing. Our film has an excellent high strength and provides a strong, permanent bond to the surface to which it is applied.
Details
- Get a strong, permanent bond to a variety of surfaces.
- Keep productivity high, with reworkable formula.
- Work effectively with a variety of substrates.
- Slight surface tack.
- Heat crosslinkable option.
- Lower temperature lamination of the nitrile phenolic film range.
Provide a strong, permanent bond to the surface to which it is applied with 3M Thermal Bonding Film 583. The film is ideal for low temperature bonding applications, such as bonding flex antenna and metal face plates to a chassis, or splicing glass fabric in PCB board manufacturing. It’s a nitrile phenolic based thermosetting adhesive film that can be heat or solvent activated (in the uncured form), or lightly cross linked using a post heat exposure. The film can be die-cut and gives a slight surface tack. It works highly effectively on a variety of substrates, is reworkable and demonstrates excellent performance in drop tests.
